Assignee
MAEDA JUN
JP·3 granted patents·2 pending applications·11 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0174US8484337B2Presence communication systemMAEDA JUN·Filed 2008·Granted Jul 9, 2013·7 cites·6 claims
- 0268US8178198B2Adhesive sheetMAEDA JUN·Filed 2011·Granted May 15, 2012·2 cites·18 claims
- 0367US8304920B2Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor waferMAEDA JUN·Filed 2009·Granted Nov 6, 2012·2 cites·10 claims
- 0447US2012302041A1Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor WaferMAEDA JUN·Filed 2012·Application pending·0 cites
- 0534US2010233868A1Adhesive Sheet and a Processing Method of Semiconductor Wafer, and a Manufacturing Method of Semiconductive ChipMAEDA JUN·Filed 2010·Application pending·0 cites
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