Assignee
MALATKAR PRAMOD
US·5 granted patents·2 pending applications·63 citations·filing 2010–2012
Top patents by PatentIndex Score
7 records- 0197US9224674B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesMALATKAR PRAMOD·Filed 2011·Granted Dec 29, 2015·38 cites·28 claims
- 0293US8848380B2Bumpless build-up layer package warpage reductionMALATKAR PRAMOD·Filed 2011·Granted Sep 30, 2014·17 cites·20 claims
- 0380US8754516B2Bumpless build-up layer package with pre-stacked microelectronic devicesMALATKAR PRAMOD·Filed 2010·Granted Jun 17, 2014·4 cites·16 claims
- 0478US9414484B2Thermal expansion compensators for controlling microelectronic package warpageMALATKAR PRAMOD·Filed 2011·Granted Aug 9, 2016·4 cites·20 claims
- 0548US9159649B2Microelectronic package and stacked microelectronic assembly and computing system containing sameMALATKAR PRAMOD·Filed 2011·Granted Oct 13, 2015·0 cites·15 claims
- 0645US2012001339A1Bumpless build-up layer package design with an interposerMALATKAR PRAMOD·Filed 2010·Application pending·0 cites
- 0741US2014001623A1Microelectronic structure having a microelectronic device disposed between an interposer and a substrateMALATKAR PRAMOD·Filed 2012·Application pending·0 cites
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