Assignee
MANGRUM MARC ALAN
US·3 granted patents·84 citations·filing 2012–2012
Top patents by PatentIndex Score
3 records- 0195US9362209B1Shielding technique for semiconductor package including metal lidMANGRUM MARC ALAN·Filed 2012·Granted Jun 7, 2016·32 cites·18 claims
- 0295US9153543B1Shielding technique for semiconductor package including metal lid and metalized contact areaMANGRUM MARC ALAN·Filed 2012·Granted Oct 6, 2015·29 cites·20 claims
- 0395US8633575B1IC package with integrated electrostatic discharge protectionMANGRUM MARC ALAN·Filed 2012·Granted Jan 21, 2014·23 cites·20 claims
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