Assignee
MARKOVICH VOYA R
US·3 granted patents·1 pending application·10 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0186US8558374B2Electronic package with thermal interposer and method of making sameMARKOVICH VOYA R·Filed 2011·Granted Oct 15, 2013·10 cites·22 claims
- 0243US2012260063A1Modular, detachable compute leaf for use with computing systemMARKOVICH VOYA R·Filed 2011·Application pending·0 cites
- 0341US8240031B2Method of joining a semiconductor device/chip to a printed wiring boardMARKOVICH VOYA R·Filed 2010·Granted Aug 14, 2012·0 cites·16 claims
- 0438US8592299B1Solder and electrically conductive adhesive based interconnection for CZT crystal attachMARKOVICH VOYA R·Filed 2012·Granted Nov 26, 2013·0 cites·8 claims
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