Assignee

MARSHALL PAUL N

1 granted patent·1 pending application·55 citations·filing 2003–2006

Technology mixH10W2 G02B1 Y10T1

Top patents by PatentIndex Score

2 records

0186US7030486B1High density integrated circuit package architectureMARSHALL PAUL N·Filed 2003·Granted Apr 18, 2006·55 cites·15 claims
0239US2006125092A1High density integrated circuit package architectureMARSHALL PAUL N·Filed 2006·Application pending·0 cites

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