Assignee
MARUO TETSUMASA
JP·1 granted patent·2 pending applications·2 citations·filing 2008–2009
Top patents by PatentIndex Score
3 records- 0152US8080855B2Semiconductor device and method of manufacturing the sameMARUO TETSUMASA·Filed 2009·Granted Dec 20, 2011·2 cites·19 claims
- 0238US2009140405A1Semiconductor device and resin adhesive used to manufacture the sameMARUO TETSUMASA·Filed 2008·Application pending·0 cites
- 0336US2010155917A1Semiconductor device and method for fabricating the sameMARUO TETSUMASA·Filed 2009·Application pending·0 cites
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