Assignee
MATERIALS RESEARCH CORP
US·52 granted patents·4,891 citations·filing 1974–1994
Top patents by PatentIndex Score
52 records- 0199US5415753AStationary aperture plate for reactive sputter depositionMATERIALS RESEARCH CORP·Filed 1993·Granted May 16, 1995·594 cites·11 claims
- 0299US5259881AWafer processing cluster tool batch preheating and degassing apparatusMATERIALS RESEARCH CORP·Filed 1991·Granted Nov 9, 1993·727 cites·14 claims
- 0397US4422896AMagnetically enhanced plasma process and apparatusMATERIALS RESEARCH CORP·Filed 1982·Granted Dec 27, 1983·102 cites·16 claims
- 0497US4198283AMagnetron sputtering target and cathode assemblyMATERIALS RESEARCH CORP·Filed 1978·Granted Apr 15, 1980·100 cites·26 claims
- 0596US4871433AMethod and apparatus for improving the uniformity ion bombardment in a magnetron sputtering systemMATERIALS RESEARCH CORP·Filed 1987·Granted Oct 3, 1989·89 cites·30 claims
- 0695US5126028ASputter coating process control method and apparatusMATERIALS RESEARCH CORP·Filed 1990·Granted Jun 30, 1992·177 cites·72 claims
- 0794US5273588ASemiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing meansMATERIALS RESEARCH CORP·Filed 1992·Granted Dec 28, 1993·228 cites·9 claims
- 0893US5370739ARotating susceptor semiconductor wafer processing cluster tool module useful for tungsten CVDMATERIALS RESEARCH CORP·Filed 1992·Granted Dec 6, 1994·188 cites·67 claims
- 0993US5280219ACluster tool soft etch module and ECR plasma generator thereforMATERIALS RESEARCH CORP·Filed 1993·Granted Jan 18, 1994·118 cites·40 claims
- 1093US5223108AExtended lifetime collimatorMATERIALS RESEARCH CORP·Filed 1991·Granted Jun 29, 1993·78 cites·13 claims
- 1192US5380682AWafer processing cluster tool batch preheating and degassing methodMATERIALS RESEARCH CORP·Filed 1993·Granted Jan 10, 1995·121 cites·12 claims
- 1292US5295777AWafer transport module with rotatable and horizontally extendable wafer holderMATERIALS RESEARCH CORP·Filed 1992·Granted Mar 22, 1994·312 cites·11 claims
- 1392US4957605AMethod and apparatus for sputter coating stepped wafersMATERIALS RESEARCH CORP·Filed 1989·Granted Sep 18, 1990·118 cites·120 claims
- 1492US4472259AFocusing magnetron sputtering apparatusMATERIALS RESEARCH CORP·Filed 1981·Granted Sep 18, 1984·49 cites·8 claims
- 1592US3953703AMethod for drying ceramic tapeMATERIALS RESEARCH CORP·Filed 1974·Granted Apr 27, 1976·51 cites·3 claims
- 1691US5356476ASemiconductor wafer processing method and apparatus with heat and gas flow controlMATERIALS RESEARCH CORP·Filed 1992·Granted Oct 18, 1994·151 cites·38 claims
- 1790US5408322ASelf aligning in-situ ellipsometer and method of using for process monitoringMATERIALS RESEARCH CORP·Filed 1993·Granted Apr 18, 1995·99 cites·21 claims
- 1890US4581118AShaped field magnetron electrodeMATERIALS RESEARCH CORP·Filed 1983·Granted Apr 8, 1986·75 cites·16 claims
- 1989US5451258AApparatus and method for improved delivery of vaporized reactant gases to a reaction chamberMATERIALS RESEARCH CORP·Filed 1994·Granted Sep 19, 1995·83 cites·37 claims
- 2089US4525262AMagnetron reactive bias sputtering method and apparatusMATERIALS RESEARCH CORP·Filed 1983·Granted Jun 25, 1985·35 cites·18 claims
- 2188US4915564AMethod and apparatus for handling and processing wafer-like materialsMATERIALS RESEARCH CORP·Filed 1988·Granted Apr 10, 1990·144 cites·38 claims
- 2287US5975912ALow temperature plasma-enhanced formation of integrated circuitsMATERIALS RESEARCH CORP·Filed 1994·Granted Nov 2, 1999·53 cites·15 claims
- 2387US5308655AProcessing for forming low resistivity titanium nitride filmsMATERIALS RESEARCH CORP·Filed 1992·Granted May 3, 1994·76 cites·4 claims
- 2486US5130005AMagnetron sputter coating method and apparatus with rotating magnet cathodeMATERIALS RESEARCH CORP·Filed 1990·Granted Jul 14, 1992·53 cites·22 claims
- 2586US4855033ACathode and target design for a sputter coating apparatusMATERIALS RESEARCH CORP·Filed 1987·Granted Aug 8, 1989·35 cites·20 claims
- 2685US5342652AMethod of nucleating tungsten on titanium nitride by CVD without silaneMATERIALS RESEARCH CORP·Filed 1992·Granted Aug 30, 1994·123 cites·20 claims
- 2785US5271963AElimination of low temperature ammonia salt in TiCl4 NH3 CVD reactionMATERIALS RESEARCH CORP·Filed 1992·Granted Dec 21, 1993·59 cites·6 claims
- 2885US4428816AFocusing magnetron sputtering apparatusMATERIALS RESEARCH CORP·Filed 1983·Granted Jan 31, 1984·27 cites·19 claims
- 2984US4587068AMethod of making ceramic tapesMATERIALS RESEARCH CORP·Filed 1983·Granted May 6, 1986·43 cites·16 claims
- 3083US4909695AMethod and apparatus for handling and processing wafer-like materialsMATERIALS RESEARCH CORP·Filed 1988·Granted Mar 20, 1990·79 cites·123 claims
- 3182US5348587AApparatus for elimination of low temperature ammonia salts in TiCl4 NH3 CVD reactionMATERIALS RESEARCH CORP·Filed 1993·Granted Sep 20, 1994·49 cites·8 claims
- 3282US5174875AMethod of enhancing the performance of a magnetron sputtering targetMATERIALS RESEARCH CORP·Filed 1991·Granted Dec 29, 1992·53 cites·12 claims
- 3381US5279857AProcess for forming low resistivity titanium nitride filmsMATERIALS RESEARCH CORP·Filed 1991·Granted Jan 18, 1994·53 cites·10 claims
- 3481US4994162APlanarization methodMATERIALS RESEARCH CORP·Filed 1989·Granted Feb 19, 1991·63 cites·19 claims
- 3579US5409590ATarget cooling and support for magnetron sputter coating apparatusMATERIALS RESEARCH CORP·Filed 1991·Granted Apr 25, 1995·36 cites·5 claims
- 3677US5336386ATarget for cathode sputteringMATERIALS RESEARCH CORP·Filed 1992·Granted Aug 9, 1994·31 cites·4 claims
- 3776US5154730ASemiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the moduleMATERIALS RESEARCH CORP·Filed 1991·Granted Oct 13, 1992·65 cites·28 claims
- 3872US5230462AMethod of soldering a sputtering target to a backing memberMATERIALS RESEARCH CORP·Filed 1992·Granted Jul 27, 1993·36 cites·24 claims
- 3970US5391281APlasma shaping plug for control of sputter etchingMATERIALS RESEARCH CORP·Filed 1993·Granted Feb 21, 1995·22 cites·22 claims
- 4069US5377816ASpiral magnetic linear translating mechanismMATERIALS RESEARCH CORP·Filed 1993·Granted Jan 3, 1995·71 cites·37 claims
- 4168US5284561AMethod and apparatus for sputter coating employing machine readable indicia carried by target assemblyMATERIALS RESEARCH CORP·Filed 1991·Granted Feb 8, 1994·19 cites·23 claims
- 4267US5455197AControl of the crystal orientation dependent properties of a film deposited on a semiconductor waferMATERIALS RESEARCH CORP·Filed 1993·Granted Oct 3, 1995·55 cites·17 claims
- 4363US5449445ASputtering target with machine readable indiciaMATERIALS RESEARCH CORP·Filed 1993·Granted Sep 12, 1995·15 cites·12 claims
- 4463US5434110AMethods of chemical vapor deposition (CVD) of tungsten films on patterned wafer substratesMATERIALS RESEARCH CORP·Filed 1992·Granted Jul 18, 1995·35 cites·2 claims
- 4556US5080772AMethod of improving ion flux distribution uniformity on a substrateMATERIALS RESEARCH CORP·Filed 1990·Granted Jan 14, 1992·17 cites·22 claims
- 4655US5205051AMethod of preventing condensation of air borne moisture onto objects in a vessel during pumping thereofMATERIALS RESEARCH CORP·Filed 1991·Granted Apr 27, 1993·25 cites·8 claims
- 4754US5474667AReduced stress sputtering target and method of manufacturing thereforMATERIALS RESEARCH CORP·Filed 1994·Granted Dec 12, 1995·16 cites·25 claims
- 4850US5439500AMagneto-optical alloy sputter targetsMATERIALS RESEARCH CORP·Filed 1993·Granted Aug 8, 1995·10 cites·28 claims
- 4947US5352248APyrometer temperature measurement of plural wafers stacked on a processing chamberMATERIALS RESEARCH CORP·Filed 1992·Granted Oct 4, 1994·13 cites·9 claims
- 5040US5237756AMethod and apparatus for reducing particulate contaminationMATERIALS RESEARCH CORP·Filed 1990·Granted Aug 24, 1993·11 cites·27 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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