Assignee
MATHEW VARUGHESE
US·6 granted patents·2 pending applications·63 citations·filing 2005–2014
Top patents by PatentIndex Score
8 records- 0197US9012263B1Method for treating a bond pad of a package substrateMATHEW VARUGHESE·Filed 2013·Granted Apr 21, 2015·42 cites·20 claims
- 0282US8168468B2Method of making a semiconductor device including a bridgeable materialMATHEW VARUGHESE·Filed 2008·Granted May 1, 2012·11 cites·20 claims
- 0378US10325876B2Surface finish for wirebondingMATHEW VARUGHESE·Filed 2014·Granted Jun 18, 2019·4 cites·10 claims
- 0475US8394713B2Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layerMATHEW VARUGHESE·Filed 2010·Granted Mar 12, 2013·4 cites·10 claims
- 0570US8955388B2Mold compound compatibility test system and methods thereofMATHEW VARUGHESE·Filed 2012·Granted Feb 17, 2015·2 cites·20 claims
- 0645US9117756B2Encapsulant with corrosion inhibitorMATHEW VARUGHESE·Filed 2012·Granted Aug 25, 2015·0 cites·18 claims
- 0742US2014242777A1Method for Bonding Semiconductor DevicesMATHEW VARUGHESE·Filed 2013·Application pending·0 cites
- 0839US2006270234A1Method and composition for preparing a semiconductor surface for deposition of a barrier materialMATHEW VARUGHESE·Filed 2005·Application pending·0 cites
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