Assignee

MATSUBARA DAIGO

JP·2 granted patents·10 citations·filing 2008–2008

Technology mixH05K2 H10W2 H10P1 Y10T1

Top patents by PatentIndex Score

2 records

0173US8217279B2Ceramic electronic component and method for manufacturing the sameMATSUBARA DAIGO·Filed 2008·Granted Jul 10, 2012·8 cites·17 claims
0256US8232481B2Wiring board with columnar conductor and method of making sameMATSUBARA DAIGO·Filed 2008·Granted Jul 31, 2012·2 cites·9 claims

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