Assignee
MATSUDA MITSUYOSHI
JP·2 granted patents·8 citations·filing 2006–2012
Top patents by PatentIndex Score
2 records- 0174US8722199B2Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foilMATSUDA MITSUYOSHI·Filed 2006·Granted May 13, 2014·7 cites·15 claims
- 0257US9077827B2Page-turning reader device and feeder deviceMATSUDA MITSUYOSHI·Filed 2012·Granted Jul 7, 2015·1 cites·18 claims
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