Assignee
MCNC
US·91 granted patents·6 pending applications·7,135 citations·filing 1988–2004
Top patents by PatentIndex Score
97 records- 0199US5955817AThermal arched beam microelectromechanical switching arrayMCNC·Filed 1999·Granted Sep 21, 1999·174 cites·5 claims
- 0298US6590267B1Microelectromechanical flexible membrane electrostatic valve device and related fabrication methodsMCNC·Filed 2000·Granted Jul 8, 2003·197 cites·28 claims
- 0398US6057520AArc resistant high voltage micromachined electrostatic switchMCNC·Filed 1999·Granted May 2, 2000·192 cites·43 claims
- 0498US6023121AThermal arched beam microelectromechanical structureMCNC·Filed 1999·Granted Feb 8, 2000·110 cites·7 claims
- 0598US5994816AThermal arched beam microelectromechanical devices and associated fabrication methodsMCNC·Filed 1997·Granted Nov 30, 1999·163 cites·19 claims
- 0698US5914801AMicroelectromechanical devices including rotating plates and related methodsMCNC·Filed 1996·Granted Jun 22, 1999·205 cites·63 claims
- 0798US5909078AThermal arched beam microelectromechanical actuatorsMCNC·Filed 1996·Granted Jun 1, 1999·202 cites·29 claims
- 0898US5475280AVertical microelectronic field emission devicesMCNC·Filed 1994·Granted Dec 12, 1995·321 cites·46 claims
- 0997US6617643B1Low power tunneling metal-oxide-semiconductor (MOS) deviceMCNC·Filed 2002·Granted Sep 9, 2003·152 cites·32 claims
- 1097US6229683B1High voltage micromachined electrostatic switchMCNC·Filed 1999·Granted May 8, 2001·164 cites·42 claims
- 1197US5206557AMicroelectromechanical transducer and fabrication methodMCNC·Filed 1990·Granted Apr 27, 1993·164 cites·43 claims
- 1296US6485273B1Distributed MEMS electrostatic pumping devicesMCNC·Filed 2000·Granted Nov 26, 2002·87 cites·58 claims
- 1396US6377438B1Hybrid microelectromechanical system tunable capacitor and associated fabrication methodsMCNC·Filed 2000·Granted Apr 23, 2002·151 cites·38 claims
- 1496US6373682B1Electrostatically controlled variable capacitorMCNC·Filed 1999·Granted Apr 16, 2002·129 cites·57 claims
- 1596US5767010ASolder bump fabrication methods and structure including a titanium barrier layerMCNC·Filed 1996·Granted Jun 16, 1998·322 cites·35 claims
- 1695US6456420B1Microelectromechanical elevating structuresMCNC·Filed 2000·Granted Sep 24, 2002·145 cites·67 claims
- 1795US6359374B1Miniature electrical relays using a piezoelectric thin film as an actuating elementMCNC·Filed 1999·Granted Mar 19, 2002·80 cites·7 claims
- 1895US5962949AMicroelectromechanical positioning apparatusMCNC·Filed 1997·Granted Oct 5, 1999·102 cites·20 claims
- 1995US5892179ASolder bumps and structures for integrated redistribution routing conductorsMCNC·Filed 1997·Granted Apr 6, 1999·91 cites·20 claims
- 2095US5638469AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1993·Granted Jun 10, 1997·161 cites·50 claims
- 2195US5325265AHigh performance integrated circuit chip packageMCNC·Filed 1992·Granted Jun 28, 1994·252 cites·29 claims
- 2295US5289631AMethod for testing, burn-in, and/or programming of integrated circuit chipsMCNC·Filed 1992·Granted Mar 1, 1994·222 cites·9 claims
- 2395US5144191AHorizontal microelectronic field emission devicesMCNC·Filed 1991·Granted Sep 1, 1992·121 cites·28 claims
- 2494US6087747AMicroelectromechanical beam for allowing a plate to rotate in relation to a frame in a microelectromechanical deviceMCNC·Filed 1999·Granted Jul 11, 2000·74 cites·4 claims
- 2594US5453661AThin film ferroelectric flat panel display devices, and methods for operating and fabricating sameMCNC·Filed 1994·Granted Sep 26, 1995·88 cites·41 claims
- 2693US6680788B1Scanning apparatus and associated methodMCNC·Filed 2000·Granted Jan 20, 2004·47 cites·30 claims
- 2793US6236491B1Micromachined electrostatic actuator with air gapMCNC·Filed 1999·Granted May 22, 2001·117 cites·71 claims
- 2892US6700309B2Miniature electrical relays using a piezoelectric thin film as an actuating elementMCNC·Filed 2002·Granted Mar 2, 2004·43 cites·8 claims
- 2992US6134042AReflective mems actuator with a laserMCNC·Filed 1999·Granted Oct 17, 2000·62 cites·8 claims
- 3092US5162257ASolder bump fabrication methodMCNC·Filed 1991·Granted Nov 10, 1992·157 cites·20 claims
- 3191US6233088B1Methods for modulating a radiation signalMCNC·Filed 2000·Granted May 15, 2001·43 cites·26 claims
- 3290US6025767AEncapsulated micro-relay modules and methods of fabricating sameMCNC·Filed 1996·Granted Feb 15, 2000·64 cites·44 claims
- 3390US5963793AMicroelectronic packaging using arched solder columnsMCNC·Filed 1998·Granted Oct 5, 1999·98 cites·21 claims
- 3490US5112439AMethod for selectively depositing material on substratesMCNC·Filed 1990·Granted May 12, 1992·136 cites·28 claims
- 3589US6256134B1Microelectromechanical devices including rotating plates and related methodsMCNC·Filed 2000·Granted Jul 3, 2001·28 cites·15 claims
- 3689US6222279B1Solder bump fabrication methods and structures including a titanium barrier layerMCNC·Filed 1998·Granted Apr 24, 2001·103 cites·7 claims
- 3789US5293006ASolder bump including circular lipMCNC·Filed 1992·Granted Mar 8, 1994·106 cites·7 claims
- 3888US6555201B1Method for fabricating a microelectromechanical bearingMCNC·Filed 2000·Granted Apr 29, 2003·51 cites·12 claims
- 3988US5290400AFabrication method for microelectromechanical transducerMCNC·Filed 1992·Granted Mar 1, 1994·46 cites·9 claims
- 4088US5045166AMagnetron method and apparatus for producing high density ionic gas dischargeMCNC·Filed 1990·Granted Sep 3, 1991·66 cites·52 claims
- 4187US6137623AModulatable reflectors and methods for using sameMCNC·Filed 1998·Granted Oct 24, 2000·71 cites·30 claims
- 4287US5237434AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1991·Granted Aug 17, 1993·75 cites·27 claims
- 4387US5001594AElectrostatic handling deviceMCNC·Filed 1989·Granted Mar 19, 1991·79 cites·21 claims
- 4486US6396620B1Electrostatically actuated electromagnetic radiation shutterMCNC·Filed 2000·Granted May 28, 2002·34 cites·34 claims
- 4586US5371431AVertical microelectronic field emission devices including elongate vertical pillars having resistive bottom portionsMCNC·Filed 1992·Granted Dec 6, 1994·41 cites·24 claims
- 4685US5902686AMethods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structuresMCNC·Filed 1996·Granted May 11, 1999·84 cites·23 claims
- 4785US5447264ARecessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1994·Granted Sep 5, 1995·79 cites·26 claims
- 4885US5037775AMethod for selectively depositing single elemental semiconductor material on substratesMCNC·Filed 1989·Granted Aug 6, 1991·68 cites·56 claims
- 4984US6593833B2Tunable microwave components utilizing ferroelectric and ferromagnetic composite dielectrics and methods for making sameMCNC·Filed 2001·Granted Jul 15, 2003·21 cites·16 claims
- 5084US5793116AMicroelectronic packaging using arched solder columnsMCNC·Filed 1996·Granted Aug 11, 1998·66 cites·19 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →