Assignee
MEMC ELECTRONICS MATERIALS INC
US·9 granted patents·322 citations·filing 1996–2007
Top patents by PatentIndex Score
9 records- 0198US7217320B2Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faultsMEMC ELECTRONICS MATERIALS INC·Filed 2004·Granted May 15, 2007·180 cites·51 claims
- 0281US7878883B2Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate controlMEMC ELECTRONICS MATERIALS INC·Filed 2007·Granted Feb 1, 2011·10 cites·17 claims
- 0372US5746834AMethod and apparatus for purging barrel reactorsMEMC ELECTRONICS MATERIALS INC·Filed 1996·Granted May 5, 1998·46 cites·15 claims
- 0467US6686260B2Process for producing thermally annealed wafers having improved internal getteringMEMC ELECTRONICS MATERIALS INC·Filed 2002·Granted Feb 3, 2004·10 cites·30 claims
- 0559US6227944B1Method for processing a semiconductor waferMEMC ELECTRONICS MATERIALS INC·Filed 1999·Granted May 8, 2001·27 cites·14 claims
- 0655US7618879B2Non-uniform minority carrier lifetime distributions in high performance silicon power devicesMEMC ELECTRONICS MATERIALS INC·Filed 2007·Granted Nov 17, 2009·0 cites·20 claims
- 0750US6112738AMethod of slicing silicon wafers for laser markingMEMC ELECTRONICS MATERIALS INC·Filed 1999·Granted Sep 5, 2000·18 cites·14 claims
- 0846US5964953APost-etching alkaline treatment processMEMC ELECTRONICS MATERIALS INC·Filed 1998·Granted Oct 12, 1999·22 cites·18 claims
- 0933US6089285AMethod and system for supplying semiconductor source materialMEMC ELECTRONICS MATERIALS INC·Filed 1998·Granted Jul 18, 2000·9 cites·23 claims
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