Assignee
MEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD
CN·5 granted patents·8 pending applications·5 citations·filing 2013–2024
Top patents by PatentIndex Score
13 records- 0179US11553282B2Differential condenser microphone with double vibrating membranesMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2020·Granted Jan 10, 2023·2 cites·13 claims
- 0275US9888324B2Capacitive micro-electro-mechanical system microphone and method for manufacturing the sameMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2015·Granted Feb 6, 2018·3 cites·15 claims
- 0360US2025102535A1Airflow sensor and airflow sensor packaging structureMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2024·Application pending·0 cites
- 0460US2025102335A1Airflow sensor and airflow sensor packaging structureMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2024·Application pending·0 cites
- 0560US2025100872A1Airflow sensor and airflow sensor packaging structureMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2024·Application pending·0 cites
- 0656US2025282611A1Micro-differential pressure sensor, packaging structure, testing method and electronic deviceMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2024·Application pending·0 cites
- 0754US12323120B2Bulk acoustic wave resonator and fabrication method for the bulk acoustic wave resonatorMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·8 claims
- 0851US2025326635A1Inertial sensor packaging method and inertial sensorMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2023·Application pending·0 cites
- 0950US12092540B2Package structure for differential pressure sensor, and electronic deviceMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·8 claims
- 1047US2025059024A1Micro-electromechanical system (mems) structure and mems microphone comprising sameMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2022·Application pending·0 cites
- 1140US2025230035A1Microphone structure, packaging structure, and electronic apparatusMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2022·Application pending·0 cites
- 1237US2018146300A1Micro-silicon microphone and fabrication method thereofMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2017·Application pending·0 cites
- 1336US9334159B2Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the sameMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2013·Granted May 10, 2016·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when MEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →