Assignee
MICROASSEMBLY TECHNOLOGIES INC
US·5 granted patents·336 citations·filing 2003–2007
Top patents by PatentIndex Score
5 records- 0196US6872902B2MEMS device with integral packagingMICROASSEMBLY TECHNOLOGIES INC·Filed 2003·Granted Mar 29, 2005·120 cites·46 claims
- 0295US6853067B1Microelectromechanical systems using thermocompression bondingMICROASSEMBLY TECHNOLOGIES INC·Filed 2003·Granted Feb 8, 2005·102 cites·41 claims
- 0394US7750462B1Microelectromechanical systems using thermocompression bondingMICROASSEMBLY TECHNOLOGIES INC·Filed 2007·Granted Jul 6, 2010·29 cites·21 claims
- 0494US7692521B1High force MEMS deviceMICROASSEMBLY TECHNOLOGIES INC·Filed 2006·Granted Apr 6, 2010·38 cites·76 claims
- 0590US7276789B1Microelectromechanical systems using thermocompression bondingMICROASSEMBLY TECHNOLOGIES INC·Filed 2004·Granted Oct 2, 2007·47 cites·29 claims
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