Assignee
MICROCHIP TECH CALDICOT LIMITED
GB·7 granted patents·4 pending applications·2 citations·filing 2018–2023
Top patents by PatentIndex Score
11 records- 0169US11189543B2Board assembly with chemical vapor deposition diamond (CVDD) windows for thermal transportMICROCHIP TECH CALDICOT LIMITED·Filed 2019·Granted Nov 30, 2021·2 cites·20 claims
- 0262US11538732B2Method for forming board assembly with chemical vapor deposition diamond (CVDD) windows for thermal transportMICROCHIP TECH CALDICOT LIMITED·Filed 2021·Granted Dec 27, 2022·0 cites·16 claims
- 0360US12482726B2Busbar with dielectric coatingMICROCHIP TECH CALDICOT LIMITED·Filed 2022·Granted Nov 25, 2025·0 cites·22 claims
- 0459US12588145B2Method for forming flipped-conductor-patchMICROCHIP TECH CALDICOT LIMITED·Filed 2022·Granted Mar 24, 2026·0 cites·19 claims
- 0558US12266908B2Device including a multiple-wavelength vertical-cavity surface-emitting laser (VCSEL) arrayMICROCHIP TECH CALDICOT LIMITED·Filed 2023·Granted Apr 1, 2025·0 cites·23 claims
- 0656US2024170383A1Electronic device including a die arranged between first and second substratesMICROCHIP TECH CALDICOT LIMITED·Filed 2023·Application pending·0 cites
- 0756US2025016929A1Substrate with embedded conductive coinMICROCHIP TECH CALDICOT LIMITED·Filed 2023·Application pending·0 cites
- 0851US2024276637A1Pcb stack with embedded component package and sintered viasMICROCHIP TECH CALDICOT LIMITED·Filed 2023·Application pending·0 cites
- 0947US2024071851A1Electronic device package including a gelMICROCHIP TECH CALDICOT LIMITED·Filed 2022·Application pending·0 cites
- 1044US11432402B2Flipped-conductor-patch lamination for ultra fine-line substrate creationMICROCHIP TECH CALDICOT LIMITED·Filed 2018·Granted Aug 30, 2022·0 cites·10 claims
- 1142US11488888B2Chemical vapor deposition diamond (CVDD) wires for thermal transportMICROCHIP TECH CALDICOT LIMITED·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
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