Assignee
MICROELECTRONICS ASSEMBLY TECH
US·7 granted patents·257 citations·filing 2007–2008
Top patents by PatentIndex Score
7 records- 0198US7796399B2Thin multi-chip flex moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2008·Granted Sep 14, 2010·110 cites·11 claims
- 0296US7393226B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Jul 1, 2008·45 cites·10 claims
- 0394US7394149B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Jul 1, 2008·29 cites·8 claims
- 0493US7724530B2Thin multi-chip flex moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2008·Granted May 25, 2010·19 cites·13 claims
- 0590US7429788B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Sep 30, 2008·21 cites·18 claims
- 0689US7787254B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Aug 31, 2010·18 cites·10 claims
- 0776US7520781B2Thin multichip flex-moduleMICROELECTRONICS ASSEMBLY TECH·Filed 2007·Granted Apr 21, 2009·15 cites·1 claims
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