Assignee
MICROELECTRONICS & COMPUTER
US·188 granted patents·12,840 citations·filing 1986–1996
Top patents by PatentIndex Score
188 records- 0199US5199918AMethod of forming field emitter device with diamond emission tipsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Apr 6, 1993·206 cites·18 claims
- 0298US5078852APlating rackMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jan 7, 1992·171 cites·15 claims
- 0398US4871316APrinted wire connectorMICROELECTRONICS & COMPUTER·Filed 1988·Granted Oct 3, 1989·180 cites·19 claims
- 0498US4758926AFluid-cooled integrated circuit packageMICROELECTRONICS & COMPUTER·Filed 1986·Granted Jul 19, 1988·244 cites·15 claims
- 0597US5449970ADiode structure flat panel displayMICROELECTRONICS & COMPUTER·Filed 1992·Granted Sep 12, 1995·113 cites·23 claims
- 0697US5388068ASuperconductor-semiconductor hybrid memory circuits with superconducting three-terminal switching devicesMICROELECTRONICS & COMPUTER·Filed 1993·Granted Feb 7, 1995·266 cites·32 claims
- 0797US5135636AElectroplating methodMICROELECTRONICS & COMPUTER·Filed 1991·Granted Aug 4, 1992·132 cites·9 claims
- 0897US4991290AFlexible electrical interconnect and method of makingMICROELECTRONICS & COMPUTER·Filed 1989·Granted Feb 12, 1991·221 cites·18 claims
- 0997US4859806ADiscretionary interconnectMICROELECTRONICS & COMPUTER·Filed 1988·Granted Aug 22, 1989·124 cites·12 claims
- 1096US5173442AMethods of forming channels and vias in insulating layersMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 22, 1992·299 cites·8 claims
- 1196US4923000AHeat exchanger having piezoelectric fan meansMICROELECTRONICS & COMPUTER·Filed 1989·Granted May 8, 1990·162 cites·7 claims
- 1295US5399238AMethod of making field emission tips using physical vapor deposition of random nuclei as etch maskMICROELECTRONICS & COMPUTER·Filed 1994·Granted Mar 21, 1995·110 cites·23 claims
- 1395US5227013AForming via holes in a multilevel substrate in a single stepMICROELECTRONICS & COMPUTER·Filed 1991·Granted Jul 13, 1993·219 cites·49 claims
- 1495US4984358AMethod of assembling stacks of integrated circuit diesMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jan 15, 1991·244 cites·20 claims
- 1595US4926241AFlip substrate for chip mountMICROELECTRONICS & COMPUTER·Filed 1988·Granted May 15, 1990·164 cites·18 claims
- 1694US5551903AFlat panel display based on diamond thin filmsMICROELECTRONICS & COMPUTER·Filed 1994·Granted Sep 3, 1996·89 cites·24 claims
- 1794US5543684AFlat panel display based on diamond thin filmsMICROELECTRONICS & COMPUTER·Filed 1994·Granted Aug 6, 1996·64 cites·28 claims
- 1894US5379191ACompact adapter package providing peripheral to area translation for an integrated circuit chipMICROELECTRONICS & COMPUTER·Filed 1994·Granted Jan 3, 1995·185 cites·8 claims
- 1994US5339391AComputer display unit with attribute enhanced scroll barMICROELECTRONICS & COMPUTER·Filed 1993·Granted Aug 16, 1994·351 cites·34 claims
- 2094US5317006ACylindrical magnetron sputtering systemMICROELECTRONICS & COMPUTER·Filed 1991·Granted May 31, 1994·85 cites·12 claims
- 2194US5170930ALiquid metal paste for thermal and electrical connectionsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Dec 15, 1992·168 cites·58 claims
- 2294US5167992ASelective electroless plating process for metal conductorsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Dec 1, 1992·112 cites·44 claims
- 2394US4953634ALow pressure high heat transfer fluid heat exchangerMICROELECTRONICS & COMPUTER·Filed 1989·Granted Sep 4, 1990·123 cites·12 claims
- 2493US5548185ATriode structure flat panel display employing flat field emission cathodeMICROELECTRONICS & COMPUTER·Filed 1995·Granted Aug 20, 1996·82 cites·43 claims
- 2593US5393613AComposition for three-dimensional metal fabrication using a laserMICROELECTRONICS & COMPUTER·Filed 1993·Granted Feb 28, 1995·91 cites·18 claims
- 2693US5341063AField emitter with diamond emission tipsMICROELECTRONICS & COMPUTER·Filed 1992·Granted Aug 23, 1994·68 cites·28 claims
- 2793US5328087AThermally and electrically conductive adhesive material and method of bonding with sameMICROELECTRONICS & COMPUTER·Filed 1993·Granted Jul 12, 1994·155 cites·68 claims
- 2893US5312514AMethod of making a field emitter device using randomly located nuclei as an etch maskMICROELECTRONICS & COMPUTER·Filed 1993·Granted May 17, 1994·90 cites·58 claims
- 2993US5289346APeripheral to area adapter with protective bumper for an integrated circuit chipMICROELECTRONICS & COMPUTER·Filed 1993·Granted Feb 22, 1994·183 cites·26 claims
- 3093US5272309ABonding metal members with multiple laser beamsMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 21, 1993·89 cites·51 claims
- 3193US5091339ATrenching techniques for forming vias and channels in multilayer electrical interconnectsMICROELECTRONICS & COMPUTER·Filed 1990·Granted Feb 25, 1992·189 cites·49 claims
- 3293US5053195ABonding amalgam and method of makingMICROELECTRONICS & COMPUTER·Filed 1989·Granted Oct 1, 1991·77 cites·13 claims
- 3393US4909315AFluid heat exchanger for an electronic componentMICROELECTRONICS & COMPUTER·Filed 1988·Granted Mar 20, 1990·106 cites·2 claims
- 3492US5314003AThree-dimensional metal fabrication using a laserMICROELECTRONICS & COMPUTER·Filed 1991·Granted May 24, 1994·84 cites·37 claims
- 3592US5101553AMethod of making a metal-on-elastomer pressure contact connectorMICROELECTRONICS & COMPUTER·Filed 1991·Granted Apr 7, 1992·82 cites·36 claims
- 3692US5071518AMethod of making an electrical multilayer interconnectMICROELECTRONICS & COMPUTER·Filed 1989·Granted Dec 10, 1991·127 cites·18 claims
- 3792US4920639AMethod of making a multilevel electrical airbridge interconnectMICROELECTRONICS & COMPUTER·Filed 1989·Granted May 1, 1990·118 cites·22 claims
- 3891US5508228ACompliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming sameMICROELECTRONICS & COMPUTER·Filed 1994·Granted Apr 16, 1996·211 cites·37 claims
- 3991US5503948AThin cell electrochemical battery system; and method of interconnecting multiple thin cellsMICROELECTRONICS & COMPUTER·Filed 1994·Granted Apr 2, 1996·80 cites·69 claims
- 4091US5021976AMethod and system for generating dynamic, interactive visual representations of information structures within a computerMICROELECTRONICS & COMPUTER·Filed 1988·Granted Jun 4, 1991·291 cites·30 claims
- 4190US4930216AProcess for preparing integrated circuit dies for mountingMICROELECTRONICS & COMPUTER·Filed 1989·Granted Jun 5, 1990·81 cites·8 claims
- 4289US5601966AMethods for fabricating flat panel display systems and componentsMICROELECTRONICS & COMPUTER·Filed 1995·Granted Feb 11, 1997·48 cites·38 claims
- 4389US5536193AMethod of making wide band gap field emitterMICROELECTRONICS & COMPUTER·Filed 1994·Granted Jul 16, 1996·48 cites·22 claims
- 4489US5272600AElectrical interconnect device with interwoven power and ground lines and capacitive viasMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 21, 1993·115 cites·23 claims
- 4589US5219787ATrenching techniques for forming channels, vias and components in substratesMICROELECTRONICS & COMPUTER·Filed 1992·Granted Jun 15, 1993·179 cites·33 claims
- 4689US5011580AMethod of reworking an electrical multilayer interconnectMICROELECTRONICS & COMPUTER·Filed 1990·Granted Apr 30, 1991·120 cites·24 claims
- 4789US4899439AMethod of fabricating a high density electrical interconnectMICROELECTRONICS & COMPUTER·Filed 1989·Granted Feb 13, 1990·78 cites·5 claims
- 4889US4874493AMethod of deposition of metal into cavities on a substrateMICROELECTRONICS & COMPUTER·Filed 1988·Granted Oct 17, 1989·66 cites·6 claims
- 4988US5686791AAmorphic diamond film flat field emission cathodeMICROELECTRONICS & COMPUTER·Filed 1995·Granted Nov 11, 1997·39 cites·6 claims
- 5088US5382315AMethod of forming etch mask using particle beam depositionMICROELECTRONICS & COMPUTER·Filed 1993·Granted Jan 17, 1995·98 cites·18 claims
Showing the top 50 of 188 patent records by PatentIndex Score.
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