Assignee
MICROWAVE BONDING INSTR INC
US·2 granted patents·3 citations·filing 2006–2007
Top patents by PatentIndex Score
2 records- 0162US7985657B1Systems and methods for bonding materials using microwave energyMICROWAVE BONDING INSTR INC·Filed 2007·Granted Jul 26, 2011·3 cites·8 claims
- 0237US7968426B1Systems and methods for bonding semiconductor substrates to metal substrates using microwave energyMICROWAVE BONDING INSTR INC·Filed 2006·Granted Jun 28, 2011·0 cites·7 claims
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