Assignee
MITSUI HIGH TEC
JP·141 granted patents·16 pending applications·1,630 citations·filing 1984–2024
Top patents by PatentIndex Score
157 records- 0198US5640047ABall grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding functionMITSUI HIGH TEC·Filed 1996·Granted Jun 17, 1997·353 cites·11 claims
- 0297US10348170B2Method for manufacturing a segmented laminated coreMITSUI HIGH TEC·Filed 2016·Granted Jul 9, 2019·20 cites·5 claims
- 0396US11632026B2Core unit manufacturing methodMITSUI HIGH TEC·Filed 2021·Granted Apr 18, 2023·2 cites·8 claims
- 0495US7777387B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2007·Granted Aug 17, 2010·35 cites·16 claims
- 0594US7698803B2Method of manufacturing laminated coreMITSUI HIGH TEC·Filed 2005·Granted Apr 20, 2010·41 cites·11 claims
- 0693US11469651B2Device for manufacturing laminated iron core and method for manufacturing laminated iron coreMITSUI HIGH TEC·Filed 2020·Granted Oct 11, 2022·2 cites·4 claims
- 0793US11146154B2Method of manufacturing a rotorMITSUI HIGH TEC·Filed 2019·Granted Oct 12, 2021·5 cites·19 claims
- 0893US7653984B2Method of resin sealing permanent magnets in laminated rotor coreMITSUI HIGH TEC·Filed 2006·Granted Feb 2, 2010·25 cites·12 claims
- 0991US6566740B2Lead frame for a semiconductor device and method of manufacturing a semiconductor deviceMITSUI HIGH TEC·Filed 2001·Granted May 20, 2003·84 cites·30 claims
- 1091US5717252ASolder-ball connected semiconductor device with a recessed chip mounting areaMITSUI HIGH TEC·Filed 1996·Granted Feb 10, 1998·159 cites·9 claims
- 1190US7897089B2Method of resin sealing permanent magnets in laminated rotor coreMITSUI HIGH TEC·Filed 2006·Granted Mar 1, 2011·14 cites·8 claims
- 1289US10033232B2Laminate and method for manufacturing the same and method for manufacturing laminated coreMITSUI HIGH TEC·Filed 2015·Granted Jul 24, 2018·4 cites·18 claims
- 1389US7667367B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2007·Granted Feb 23, 2010·35 cites·18 claims
- 1488US11865739B2Method of manufacturing a core productMITSUI HIGH TEC·Filed 2021·Granted Jan 9, 2024·2 cites·3 claims
- 1588US11393623B2Method for manufacturing iron core productMITSUI HIGH TEC·Filed 2019·Granted Jul 19, 2022·3 cites·6 claims
- 1687US11374474B2Method of manufacturing core product, and core productMITSUI HIGH TEC·Filed 2020·Granted Jun 28, 2022·2 cites·2 claims
- 1787US11277059B2Core product and method of manufacturing core productMITSUI HIGH TEC·Filed 2019·Granted Mar 15, 2022·4 cites·10 claims
- 1887US7928627B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2010·Granted Apr 19, 2011·7 cites·3 claims
- 1987US7847466B2Laminated core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2007·Granted Dec 7, 2010·15 cites·16 claims
- 2087US5661086AProcess for manufacturing a plurality of strip lead frame semiconductor devicesMITSUI HIGH TEC·Filed 1996·Granted Aug 26, 1997·126 cites·10 claims
- 2186US7950133B2Method of resin sealing permanent magnets in laminated rotor coreMITSUI HIGH TEC·Filed 2009·Granted May 31, 2011·11 cites·6 claims
- 2285US10784732B2Method of punching a core piece having a bridgeMITSUI HIGH TEC·Filed 2018·Granted Sep 22, 2020·2 cites·9 claims
- 2385US10630153B2Laminated core and method for manufacturing sameMITSUI HIGH TEC·Filed 2015·Granted Apr 21, 2020·3 cites·19 claims
- 2483US10252318B2Die apparatus and method for blanking thin plateMITSUI HIGH TEC·Filed 2016·Granted Apr 9, 2019·3 cites·12 claims
- 2583US9979264B2Method for manufacturing laminated rotor coreMITSUI HIGH TEC·Filed 2013·Granted May 22, 2018·5 cites·9 claims
- 2683US9948153B2Stacked core having a plurality of core pieces and a bridge portionMITSUI HIGH TEC·Filed 2015·Granted Apr 17, 2018·4 cites·3 claims
- 2782US10821637B2Resin injection apparatus and method of manufacturing core productMITSUI HIGH TEC·Filed 2017·Granted Nov 3, 2020·2 cites·20 claims
- 2882US10418886B2Method for manufacturing laminated coreMITSUI HIGH TEC·Filed 2015·Granted Sep 17, 2019·4 cites·24 claims
- 2981US10848039B2Method of manufacturing laminated rotor coreMITSUI HIGH TEC·Filed 2017·Granted Nov 24, 2020·2 cites·16 claims
- 3081US10283264B2Method of manufacturing laminated coreMITSUI HIGH TEC·Filed 2018·Granted May 7, 2019·1 cites·5 claims
- 3181US10063126B2Method and apparatus for manufacturing laminated iron coreMITSUI HIGH TEC·Filed 2016·Granted Aug 28, 2018·2 cites·14 claims
- 3281US7893591B2Laminated rotor core and method for manufacturing the sameMITSUI HIGH TEC·Filed 2007·Granted Feb 22, 2011·12 cites·17 claims
- 3381US6563199B2Lead frame for semiconductor devices, a semiconductor device made using the lead frameMITSUI HIGH TEC·Filed 2001·Granted May 13, 2003·37 cites·29 claims
- 3480US11088600B2Method for manufacturing rotor coreMITSUI HIGH TEC·Filed 2018·Granted Aug 10, 2021·2 cites·9 claims
- 3580US10284058B2Method and apparatus for manufacturing laminated coresMITSUI HIGH TEC·Filed 2015·Granted May 7, 2019·2 cites·7 claims
- 3680US4597168AMethod and apparatus for producing laminated iron coresMITSUI HIGH TEC·Filed 1984·Granted Jul 1, 1986·45 cites·5 claims
- 3779US10447123B2Apparatus for inserting magnet into rotor iron coreMITSUI HIGH TEC·Filed 2016·Granted Oct 15, 2019·2 cites·5 claims
- 3877US6388311B1Semiconductor deviceMITSUI HIGH TEC·Filed 1999·Granted May 14, 2002·75 cites·4 claims
- 3976US11451122B2Method for manufacturing laminated iron core productMITSUI HIGH TEC·Filed 2019·Granted Sep 20, 2022·1 cites·4 claims
- 4076US9373991B2Method for manufacturing laminated iron coreMITSUI HIGH TEC·Filed 2013·Granted Jun 21, 2016·3 cites·6 claims
- 4175US6809409B2Lead frame and semiconductor device made using the lead frameMITSUI HIGH TEC·Filed 2002·Granted Oct 26, 2004·24 cites·50 claims
- 4274US11196324B2Method of manufacturing stacked core with adhesiveMITSUI HIGH TEC·Filed 2019·Granted Dec 7, 2021·1 cites·6 claims
- 4374US10615673B2Apparatus and method for injecting resin into laminated iron coreMITSUI HIGH TEC·Filed 2017·Granted Apr 7, 2020·1 cites·12 claims
- 4474US6700186B2Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor deviceMITSUI HIGH TEC·Filed 2001·Granted Mar 2, 2004·31 cites·43 claims
- 4573US7352101B2Skew shape variable laminated iron core and method of manufacturing the sameMITSUI HIGH TEC·Filed 2004·Granted Apr 1, 2008·20 cites·11 claims
- 4672US10298103B2Manufacturing method of laminated core and manufacturing device of laminated coreMITSUI HIGH TEC·Filed 2017·Granted May 21, 2019·4 cites·14 claims
- 4772US10109417B2Laminated iron core and method of manufacturing laminated iron core with caulking protrusionMITSUI HIGH TEC·Filed 2015·Granted Oct 23, 2018·4 cites·13 claims
- 4871US11705794B2Stacked stator coreMITSUI HIGH TEC·Filed 2021·Granted Jul 18, 2023·0 cites·16 claims
- 4971US11469653B2Method of manufacturing rotating bodyMITSUI HIGH TEC·Filed 2020·Granted Oct 11, 2022·0 cites·9 claims
- 5071US11190087B2Method for manufacturing a laminated iron coreMITSUI HIGH TEC·Filed 2020·Granted Nov 30, 2021·0 cites·6 claims
Showing the top 50 of 157 patent records by PatentIndex Score.
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