Assignee
MIWA KEISHI
JP·6 granted patents·1 pending application·1 citations·filing 2019–2025
Top patents by PatentIndex Score
7 records- 0177US10744768B2Bonded substrate, liquid discharge head, and liquid discharge apparatusMIWA KEISHI·Filed 2019·Granted Aug 18, 2020·1 cites·16 claims
- 0269US12202268B2Liquid discharge head and liquid discharge apparatusMIWA KEISHI·Filed 2022·Granted Jan 21, 2025·0 cites·10 claims
- 0366US12151478B2Head module, liquid discharge head, and liquid discharge apparatusMIWA KEISHI·Filed 2022·Granted Nov 26, 2024·0 cites·18 claims
- 0466US12145367B2Liquid discharge head and liquid discharge apparatusMIWA KEISHI·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 0561US12558893B2Piezoelectric actuator, liquid discharge head, and liquid discharge apparatusMIWA KEISHI·Filed 2024·Granted Feb 24, 2026·0 cites·12 claims
- 0655US12528292B2Liquid discharge head, liquid discharge head unit, and liquid discharge apparatusMIWA KEISHI·Filed 2023·Granted Jan 20, 2026·0 cites·17 claims
- 0747US2025242590A1Piezoelectric actuator, liquid discharge head, and liquid discharge apparatusMIWA KEISHI·Filed 2025·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →