Assignee
MIYAKAWA TOMOYUKI
JP·3 granted patents·17 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0187US8872024B2Mold structure for molding housing, method for molding housing, and housingMIYAKAWA TOMOYUKI·Filed 2012·Granted Oct 28, 2014·17 cites·2 claims
- 0241US8932503B2Mold structure for molding housing, method for molding housing, and housingMIYAKAWA TOMOYUKI·Filed 2012·Granted Jan 13, 2015·0 cites·2 claims
- 0339US8430662B2Mold structure for molding housing, method for molding housing, and housingMIYAKAWA TOMOYUKI·Filed 2010·Granted Apr 30, 2013·0 cites·3 claims
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