Assignee
MIYAKE HIDETAKA
JP·4 granted patents·1 pending application·2 citations·filing 2005–2012
Top patents by PatentIndex Score
5 records- 0161US9387548B2Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing methodMIYAKE HIDETAKA·Filed 2011·Granted Jul 12, 2016·1 cites·13 claims
- 0259US9950379B2Wire electric discharge machining apparatusMIYAKE HIDETAKA·Filed 2010·Granted Apr 24, 2018·1 cites·4 claims
- 0358US9050672B2Wire discharge-machining apparatus with parallel cutting wiresMIYAKE HIDETAKA·Filed 2009·Granted Jun 9, 2015·0 cites·9 claims
- 0447US8664559B2Electrical discharge machineMIYAKE HIDETAKA·Filed 2005·Granted Mar 4, 2014·0 cites·15 claims
- 0540US2015053650A1Wire discharge machining apparatus and manufacturing method for semiconductor wafers using the sameMIYAKE HIDETAKA·Filed 2012·Application pending·0 cites
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