Assignee
MIZUTANI HIDEO
JP·3 granted patents·2 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0164US8161637B2Manufacturing method for printed wiring boardMIZUTANI HIDEO·Filed 2010·Granted Apr 24, 2012·2 cites·16 claims
- 0247US9113562B2Manufacturing method for printed wiring boardMIZUTANI HIDEO·Filed 2012·Granted Aug 18, 2015·0 cites·20 claims
- 0343US10541160B2Substrate case and substrate accommodation apparatusMIZUTANI HIDEO·Filed 2010·Granted Jan 21, 2020·0 cites·17 claims
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