Assignee

MOORE DARREN L

US·1 granted patent·1 citations·filing 2008–2008

Technology mixC08J1 H10P1 H10W1

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0149US8338315B2Processes for curing silicon based low-k dielectric materialsMOORE DARREN L·Filed 2008·Granted Dec 25, 2012·1 cites·20 claims

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