Assignee
MOTOBE HIDETSUGU
JP·2 granted patents·2 citations·filing 2003–2004
Top patents by PatentIndex Score
2 records- 0140US8062750B2Epoxy resin composition for prepreg, prepreg and multilayered printed wiring boardMOTOBE HIDETSUGU·Filed 2004·Granted Nov 22, 2011·2 cites·14 claims
- 0233US8470938B2Resin composition for printed wiring board, prepreg, and laminate obtained with the sameMOTOBE HIDETSUGU·Filed 2003·Granted Jun 25, 2013·0 cites·14 claims
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