Assignee

MOTORLLA INC

US·1 granted patent·40 citations·filing 1999–1999

Technology mixH05K1 H10P1 H10W1 Y02P1

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0169US6444563B1Method and apparatus for extending fatigue life of solder joints in a semiconductor deviceMOTORLLA INC·Filed 1999·Granted Sep 3, 2002·40 cites·9 claims

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