Assignee
MUNIANDY KESVAKUMAR V C
MY·5 granted patents·3 pending applications·104 citations·filing 2012–2014
Top patents by PatentIndex Score
8 records- 0196US8669140B1Method of forming stacked die package using redistributed chip packagingMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Mar 11, 2014·51 cites·20 claims
- 0295US9064718B1Pre-formed via array for integrated circuit packageMUNIANDY KESVAKUMAR V C·Filed 2014·Granted Jun 23, 2015·37 cites·18 claims
- 0392US8772913B1Stiffened semiconductor die packageMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Jul 8, 2014·14 cites·9 claims
- 0471US8945989B2Stiffened semiconductor die packageMUNIANDY KESVAKUMAR V C·Filed 2014·Granted Feb 3, 2015·2 cites·11 claims
- 0543US2016056094A1Ball grid array package with more signal routing structuresMUNIANDY KESVAKUMAR V C·Filed 2014·Application pending·0 cites
- 0642US2015187728A1Emiconductor device with die top power connectionsMUNIANDY KESVAKUMAR V C·Filed 2013·Application pending·0 cites
- 0740US8853058B2Method of making surface mount stacked semiconductor devicesMUNIANDY KESVAKUMAR V C·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
- 0840US2015206769A1Lead frame based semiconductor device with power barsMUNIANDY KESVAKUMAR V C·Filed 2014·Application pending·0 cites
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