Assignee
MURAI HIDEYA
JP·1 granted patent·1 pending application·14 citations·filing 2010–2010
Top patents by PatentIndex Score
2 records- 0189US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0234US2012153501A1Semiconductor device and manufacturing method thereofMURAI HIDEYA·Filed 2010·Application pending·0 cites
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