Assignee
MURAMATSU SHIGETSUGU
JP·6 granted patents·1 pending application·23 citations·filing 2005–2011
Top patents by PatentIndex Score
7 records- 0183US8835773B2Wiring board and method of manufacturing the sameMURAMATSU SHIGETSUGU·Filed 2010·Granted Sep 16, 2014·8 cites·4 claims
- 0278US8115300B2Wiring substrate and manufacturing method thereof, and semiconductor apparatusMURAMATSU SHIGETSUGU·Filed 2007·Granted Feb 14, 2012·7 cites·6 claims
- 0372US8222532B2Method for manufacturing a wiring boardMURAMATSU SHIGETSUGU·Filed 2011·Granted Jul 17, 2012·3 cites·8 claims
- 0468US8575495B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Nov 5, 2013·3 cites·13 claims
- 0556US9741647B2Wiring substrate, semiconductor device, and method of manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Aug 22, 2017·1 cites·12 claims
- 0656US8508050B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Aug 13, 2013·1 cites·11 claims
- 0743US2006043570A1Substrate, semiconductor device, substrate fabricating method, and semiconductor device fabricating methodMURAMATSU SHIGETSUGU·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when MURAMATSU SHIGETSUGU files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →