Assignee
NAKATANI SEIICHI
JP·5 granted patents·8 citations·filing 2008–2011
Top patents by PatentIndex Score
5 records- 0177US8288778B2Semiconductor device having semiconductor elements formed inside a resin film substrateNAKATANI SEIICHI·Filed 2008·Granted Oct 16, 2012·4 cites·23 claims
- 0266US8193526B2Transistor having an organic semiconductor with a hollow spaceNAKATANI SEIICHI·Filed 2008·Granted Jun 5, 2012·2 cites·19 claims
- 0364US9076714B2Substrate for mounting light-emitting element and light-emitting deviceNAKATANI SEIICHI·Filed 2011·Granted Jul 7, 2015·2 cites·8 claims
- 0445US8071425B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusNAKATANI SEIICHI·Filed 2010·Granted Dec 6, 2011·0 cites·11 claims
- 0539US9107306B2Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit packageNAKATANI SEIICHI·Filed 2011·Granted Aug 11, 2015·0 cites·5 claims
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