Assignee
NANTONG FUJITSU MICROELECT CO
CN·12 granted patents·4 pending applications·32 citations·filing 2013–2016
Top patents by PatentIndex Score
16 records- 0187US9548282B2Metal contact for semiconductor deviceNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Jan 17, 2017·10 cites·6 claims
- 0280US9293432B2Metal contact for chip packaging structureNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Mar 22, 2016·7 cites·16 claims
- 0374US9397070B2Method for forming package structureNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Jul 19, 2016·4 cites·10 claims
- 0472US9293338B2Semiconductor packaging structure and methodNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Mar 22, 2016·3 cites·11 claims
- 0570US9485868B2Package structureNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Nov 1, 2016·3 cites·12 claims
- 0668US9379077B2Metal contact for semiconductor deviceNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Jun 28, 2016·2 cites·16 claims
- 0766US9502337B2Flip-chip on leadframe semiconductor packaging structure and fabrication method thereofNANTONG FUJITSU MICROELECT CO·Filed 2015·Granted Nov 22, 2016·1 cites·18 claims
- 0864US9431325B2Semiconductor packaging structureNANTONG FUJITSU MICROELECT CO·Filed 2016·Granted Aug 30, 2016·1 cites·11 claims
- 0956US9515010B2Semiconductor packaging structure and forming method thereforNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Dec 6, 2016·1 cites·8 claims
- 1046US9287205B2Fan-out high-density packaging methods and structuresNANTONG FUJITSU MICROELECT CO·Filed 2015·Granted Mar 15, 2016·0 cites·15 claims
- 1142US9589815B2Semiconductor IC packaging methods and structuresNANTONG FUJITSU MICROELECT CO·Filed 2013·Granted Mar 7, 2017·0 cites·16 claims
- 1235US2016189983A1Method and structure for fan-out wafer level packagingNANTONG FUJITSU MICROELECT CO·Filed 2015·Application pending·0 cites
- 1335US2016190028A1Method and structure for fan-out wafer level packagingNANTONG FUJITSU MICROELECT CO·Filed 2015·Application pending·0 cites
- 1434US2015380369A1Wafer packaging structure and packaging methodNANTONG FUJITSU MICROELECT CO·Filed 2014·Application pending·0 cites
- 1525US2016172313A1Substrate with a supporting plate and fabrication method thereofNANTONG FUJITSU MICROELECT CO·Filed 2015·Application pending·0 cites
- 1620US9437511B2Method and structure for wafer-level packagingNANTONG FUJITSU MICROELECT CO·Filed 2015·Granted Sep 6, 2016·0 cites·19 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →