Assignee
NANTONG TONGFU MICROELECTRONICS CO LTD
CN·3 granted patents·2 pending applications·1 citations·filing 2020–2025
Top patents by PatentIndex Score
5 records- 0175US12438098B2Packaging structure and fabrication method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Granted Oct 7, 2025·1 cites·16 claims
- 0275US2025372532A1Packaging structureNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0347US12205828B2Packaging structure and fabrication method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Granted Jan 21, 2025·0 cites·17 claims
- 0445US12564083B2Packaging structure having semiconductor chips and encapsulation layers and formation method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Granted Feb 24, 2026·0 cites·20 claims
- 0543US2022246540A1Packaging structure and formation method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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