Assignee
NAT CENTER FOR ADVANCED PACKAGING CO LTD
CN·11 granted patents·2 pending applications·26 citations·filing 2014–2022
Top patents by PatentIndex Score
13 records- 0185US9653378B2Heat dissipation solution for advanced chip packagesNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted May 16, 2017·19 cites·14 claims
- 0282US11067459B1Stress sensor structure and a manufacturing method thereofNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2017·Granted Jul 20, 2021·6 cites·10 claims
- 0358US10015889B2Method for constructing an external circuit structureNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2014·Granted Jul 3, 2018·1 cites·10 claims
- 0451US2024186200A1Sensing chip packaging structure and methodNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2022·Application pending·0 cites
- 0548US12512392B2Package structure for reducing warpage of plastic package wafer and method for manufacturing the sameNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·7 claims
- 0642US11346920B2Radar component package and method for manufacturing the sameNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2017·Granted May 31, 2022·0 cites·14 claims
- 0742US9583418B2Chip embedded package method and structureNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2014·Granted Feb 28, 2017·0 cites·7 claims
- 0842US2022115356A1Fan-out encapsulation structure and encapsulation method for chipNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2019·Application pending·0 cites
- 0941US11854794B2Semiconductor cleaning equipment and method for cleaning through vias using the sameNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2018·Granted Dec 26, 2023·0 cites·12 claims
- 1038US9638875B2Optical communication apparatus and method of assembling the sameNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted May 2, 2017·0 cites·20 claims
- 1138US9589786B2Method for polishing a polymer surfaceNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted Mar 7, 2017·0 cites·19 claims
- 1237US9773684B2Method of manufacturing fan out wafer level packageNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·6 claims
- 1335US10209467B2Active optical adapter plate and optical interconnection moduleNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2017·Granted Feb 19, 2019·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →