Assignee
NCC NANO LLC
US·29 granted patents·3 pending applications·125 citations·filing 2005–2024
Top patents by PatentIndex Score
32 records- 0195US7820097B2Electrical, plating and catalytic uses of metal nanomaterial compositionsNCC NANO LLC·Filed 2005·Granted Oct 26, 2010·48 cites·10 claims
- 0293US11358381B1Method for attaching and detaching substrates during integrated circuit manufacturingNCC NANO LLC·Filed 2021·Granted Jun 14, 2022·6 cites·16 claims
- 0393US8674618B2Method and apparatus for curing thin films on low-temperature substrates at high speedsNCC NANO LLC·Filed 2013·Granted Mar 18, 2014·11 cites·17 claims
- 0492US11621175B1Method and apparatus for removing particles from the surface of a semiconductor waferNCC NANO LLC·Filed 2021·Granted Apr 4, 2023·3 cites·4 claims
- 0591US9643208B2Method and apparatus for curing thin films on low-temperature substrates at high speedsNCC NANO LLC·Filed 2015·Granted May 9, 2017·7 cites·6 claims
- 0691US9095874B2Method and apparatus for curing thin films on low-temperature substrates at high speedsNCC NANO LLC·Filed 2014·Granted Aug 4, 2015·10 cites·13 claims
- 0790US11769660B2Method and apparatus for removing particles from the surface of a semiconductor waferNCC NANO LLC·Filed 2021·Granted Sep 26, 2023·2 cites·5 claims
- 0890US11688600B1Method and apparatus for removing particles from the surface of a semiconductor waferNCC NANO LLC·Filed 2021·Granted Jun 27, 2023·2 cites·10 claims
- 0989US10537029B2Method for reducing thin films on low temperature substratesNCC NANO LLC·Filed 2017·Granted Jan 14, 2020·3 cites·18 claims
- 1089US9907183B2Electrical, plating and catalytic uses of metal nanomaterial compositionsNCC NANO LLC·Filed 2016·Granted Feb 27, 2018·2 cites·7 claims
- 1189US9839139B2Method for reducing thin films on low temperature substratesNCC NANO LLC·Filed 2014·Granted Dec 5, 2017·3 cites·10 claims
- 1288US11647594B2Method for curing solder paste on a thermally fragile substrateNCC NANO LLC·Filed 2020·Granted May 9, 2023·2 cites·8 claims
- 1386US10011104B2Method for performing delamination of a polymer filmNCC NANO LLC·Filed 2016·Granted Jul 3, 2018·5 cites·19 claims
- 1485US11230509B2Method for manufacturing energetic material compositesNCC NANO LLC·Filed 2017·Granted Jan 25, 2022·2 cites·3 claims
- 1584US11996384B2Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsNCC NANO LLC·Filed 2020·Granted May 28, 2024·2 cites·5 claims
- 1684US9006047B2Method for providing lateral thermal processing of thin films on low-temperature substratesNCC NANO LLC·Filed 2013·Granted Apr 14, 2015·4 cites·14 claims
- 1784US8361257B2Laminated energetic deviceNCC NANO LLC·Filed 2012·Granted Jan 29, 2013·3 cites·6 claims
- 1883US10422578B2Apparatus for curing thin films on a moving substrateNCC NANO LLC·Filed 2017·Granted Sep 24, 2019·2 cites·2 claims
- 1978US12519078B2Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsNCC NANO LLC·Filed 2024·Granted Jan 6, 2026·0 cites·14 claims
- 2077US12538830B2Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsNCC NANO LLC·Filed 2024·Granted Jan 27, 2026·0 cites·16 claims
- 2177US11317517B2Method for connecting surface-mount electronic components to a circuit boardNCC NANO LLC·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 2276US11172579B2Method for reducing thin films on low temperature substratesNCC NANO LLC·Filed 2019·Granted Nov 9, 2021·0 cites·16 claims
- 2374US11089690B2Method for depositing a functional material on a substrateNCC NANO LLC·Filed 2016·Granted Aug 10, 2021·2 cites·8 claims
- 2472US10986698B2Apparatus for providing transient thermal profile processing on a moving substrateNCC NANO LLC·Filed 2014·Granted Apr 20, 2021·2 cites·16 claims
- 2572US2018139850A1Electrical, plating and catalytic uses of metal nanomaterial compositionsNCC NANO LLC·Filed 2018·Application pending·0 cites
- 2662US9743516B2Method for forming thin film conductors on a substrateNCC NANO LLC·Filed 2012·Granted Aug 22, 2017·2 cites·14 claims
- 2759US10244636B2Method and apparatus for curing thin films on low-temperature substrates at high speedsNCC NANO LLC·Filed 2017·Granted Mar 26, 2019·0 cites·8 claims
- 2855US10667405B2Method for deposting a functional material on a substrateNCC NANO LLC·Filed 2017·Granted May 26, 2020·0 cites·22 claims
- 2952US10849239B2Method for curing solder paste on a thermally fragile substrateNCC NANO LLC·Filed 2018·Granted Nov 24, 2020·0 cites·11 claims
- 3046US2018171468A1Method for deposting a functional material on a substrateNCC NANO LLC·Filed 2016·Application pending·0 cites
- 3144US11230036B2Method for performing delamination of a polymer filmNCC NANO LLC·Filed 2016·Granted Jan 25, 2022·0 cites·20 claims
- 3237US2011247851A1Apparatus for curing thin films on a moving substrateNCC NANO LLC·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →