Assignee
NEC TOPPAN CIRCUIT SOLUTIONS
JP·13 granted patents·4 pending applications·172 citations·filing 2000–2007
Top patents by PatentIndex Score
17 records- 0185US7317610B2Sheet-shaped capacitor and method for manufacture thereofNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2005·Granted Jan 8, 2008·15 cites·21 claims
- 0284US7303978B2Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor deviceNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2005·Granted Dec 4, 2007·12 cites·2 claims
- 0381US6717494B2Printed-circuit board, coaxial cable, and electronic deviceNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Apr 6, 2004·32 cites·23 claims
- 0477US6608946B2Optical module and method for manufacturing the sameNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2001·Granted Aug 19, 2003·19 cites·20 claims
- 0576US6938336B2Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the boardNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Sep 6, 2005·20 cites·13 claims
- 0673US6560505B1Automatic parts placement system, method, and mediumNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2000·Granted May 6, 2003·25 cites·34 claims
- 0772US6563057B2Printed circuit board and method for manufacturing sameNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2000·Granted May 13, 2003·20 cites·8 claims
- 0871US6791675B2Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structureNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2001·Granted Sep 14, 2004·13 cites·17 claims
- 0956US6709803B2Process for producing printed wiring boardNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Mar 23, 2004·6 cites·12 claims
- 1055US6999643B2Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring boardNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Feb 14, 2006·4 cites·19 claims
- 1152US6702176B2Solder, method for processing surface of printed wiring board, and method for mounting electronic partNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2001·Granted Mar 9, 2004·4 cites·2 claims
- 1248US2003097311A1Custom product order acceptance supporting apparatusNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Application pending·0 cites
- 1344US2007241463A1Electrode, manufacturing method of the same, and semiconductor device having the sameNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2007·Application pending·0 cites
- 1443US2007164457A1Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor deviceNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2007·Application pending·0 cites
- 1539US2003155638A1Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor deviceNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2003·Application pending·0 cites
- 1634US6502228B1Route determination support device, route determination support method and storage medium storing therein program for executing method thereof, and printed substrate wiring methodNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2000·Granted Dec 31, 2002·2 cites·50 claims
- 1733US7106426B2Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalkNEC TOPPAN CIRCUIT SOLUTIONS·Filed 2002·Granted Sep 12, 2006·0 cites·4 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →