Assignee
NIHON HANDA CO LTD
JP·2 granted patents·22 citations·filing 2006–2014
Top patents by PatentIndex Score
2 records- 0189US7766218B2Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring boardNIHON HANDA CO LTD·Filed 2006·Granted Aug 3, 2010·22 cites·11 claims
- 0241US10189119B2Solder alloy for die bondingNIHON HANDA CO LTD·Filed 2014·Granted Jan 29, 2019·0 cites·8 claims
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