Assignee
NIHON SUPERIOR SHA CO LTD
US·5 granted patents·70 citations·filing 1999–2006
Top patents by PatentIndex Score
5 records- 0172US6296722B1Lead-free solder alloyNIHON SUPERIOR SHA CO LTD·Filed 1999·Granted Oct 2, 2001·30 cites·3 claims
- 0264US6180055B1Lead-free solder alloyNIHON SUPERIOR SHA CO LTD·Filed 1999·Granted Jan 30, 2001·32 cites·12 claims
- 0359US7861909B2Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bathNIHON SUPERIOR SHA CO LTD·Filed 2006·Granted Jan 4, 2011·1 cites·6 claims
- 0456US6699306B2Control method for copper density in a solder dipping bathNIHON SUPERIOR SHA CO LTD·Filed 2001·Granted Mar 2, 2004·7 cites·21 claims
- 0551US7591873B2Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tinNIHON SUPERIOR SHA CO LTD·Filed 2006·Granted Sep 22, 2009·0 cites·6 claims
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