Assignee
NIKKA SEIKO CO LTD
JP·3 granted patents·2 citations·filing 2014–2019
Top patents by PatentIndex Score
3 records- 0160US9502295B2Protective film material for laser processing and wafer processing method using the protective film materialNIKKA SEIKO CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·21 claims
- 0244US10700016B2Protective film material for laser processing and wafer processing method using the protective film materialNIKKA SEIKO CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·8 claims
- 0335US11608433B2Formulation and processing solution for dicing process, and method for processingNIKKA SEIKO CO LTD·Filed 2019·Granted Mar 21, 2023·0 cites·14 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →