Assignee
NIPPEI TOYAMA CORP
JP·54 granted patents·1,056 citations·filing 1986–2007
Top patents by PatentIndex Score
54 records- 0191USD548755SMachining centerNIPPEI TOYAMA CORP·Filed 2006·Granted Aug 14, 2007·65 cites·1 claims
- 0289US6680459B2Laser beam machining apparatus and laser beam machining methodNIPPEI TOYAMA CORP·Filed 2002·Granted Jan 20, 2004·76 cites·14 claims
- 0389US5201305ABrittle material cutting methodNIPPEI TOYAMA CORP·Filed 1991·Granted Apr 13, 1993·71 cites·3 claims
- 0488US7367762B2Main spindle apparatus and tool holder clamp unit used thereforNIPPEI TOYAMA CORP·Filed 2005·Granted May 6, 2008·22 cites·17 claims
- 0588US5103074ALaser processing method and apparatusNIPPEI TOYAMA CORP·Filed 1989·Granted Apr 7, 1992·30 cites·6 claims
- 0687US5799643ASlurry managing system and slurry managing method for wire sawsNIPPEI TOYAMA CORP·Filed 1996·Granted Sep 1, 1998·67 cites·25 claims
- 0786USD548754SMachining centerNIPPEI TOYAMA CORP·Filed 2006·Granted Aug 14, 2007·55 cites·1 claims
- 0883USD567263SMachining centerNIPPEI TOYAMA CORP·Filed 2006·Granted Apr 22, 2008·49 cites·1 claims
- 0980US4984390AGrinding disc dressing apparatusNIPPEI TOYAMA CORP·Filed 1989·Granted Jan 15, 1991·25 cites·16 claims
- 1074US6436021B2Method and apparatus for supplying lubricantNIPPEI TOYAMA CORP·Filed 2001·Granted Aug 20, 2002·23 cites·15 claims
- 1174US6332834B1Method and apparatus for grinding a workpieceNIPPEI TOYAMA CORP·Filed 2000·Granted Dec 25, 2001·18 cites·23 claims
- 1274US6302769B1Method for chamfering a waferNIPPEI TOYAMA CORP·Filed 1999·Granted Oct 16, 2001·45 cites·31 claims
- 1374US6071220ATool change device and tool change methodNIPPEI TOYAMA CORP·Filed 1998·Granted Jun 6, 2000·32 cites·39 claims
- 1473US6198070B1Laser beam machining method and laser beam machineNIPPEI TOYAMA CORP·Filed 1999·Granted Mar 6, 2001·32 cites·14 claims
- 1572US5817711AAqueous working liquid composition for wire sawNIPPEI TOYAMA CORP·Filed 1997·Granted Oct 6, 1998·30 cites·4 claims
- 1668US7424846B2Pneumatically static balancer for machine toolNIPPEI TOYAMA CORP·Filed 2006·Granted Sep 16, 2008·4 cites·3 claims
- 1768US5500507ALaser beam machining device and laser beam machining methodNIPPEI TOYAMA CORP·Filed 1992·Granted Mar 19, 1996·38 cites·15 claims
- 1867US7269472B2Many-headed grinding machine and grinding method using many-headed grinding machineNIPPEI TOYAMA CORP·Filed 2005·Granted Sep 11, 2007·5 cites·9 claims
- 1964US6439969B1Apparatus and method of chamfering waferNIPPEI TOYAMA CORP·Filed 2000·Granted Aug 27, 2002·18 cites·26 claims
- 2064USD399857SReel bobbin for a wire saw for semiconductorsNIPPEI TOYAMA CORP·Filed 1997·Granted Oct 20, 1998·15 cites·1 claims
- 2160US6182729B1System and method for processing ingotsNIPPEI TOYAMA CORP·Filed 1998·Granted Feb 6, 2001·21 cites·21 claims
- 2260US6095129ATension adjusting mechanism for wire sawNIPPEI TOYAMA CORP·Filed 1998·Granted Aug 1, 2000·21 cites·18 claims
- 2360US6056031ASystem and method for processing ingotsNIPPEI TOYAMA CORP·Filed 1998·Granted May 2, 2000·21 cites·20 claims
- 2459US4673173AWorkpiece clamping deviceNIPPEI TOYAMA CORP·Filed 1986·Granted Jun 16, 1987·21 cites·2 claims
- 2558US6722956B2Working apparatusNIPPEI TOYAMA CORP·Filed 2000·Granted Apr 20, 2004·9 cites·21 claims
- 2658US5865162AWire saw and work slicing methodNIPPEI TOYAMA CORP·Filed 1997·Granted Feb 2, 1999·21 cites·17 claims
- 2755US7182720B2Machine toolNIPPEI TOYAMA CORP·Filed 2004·Granted Feb 27, 2007·8 cites·15 claims
- 2855US7146241B2Machine tool control apparatusNIPPEI TOYAMA CORP·Filed 2004·Granted Dec 5, 2006·5 cites·5 claims
- 2955US4748570AClamping confirming deviceNIPPEI TOYAMA CORP·Filed 1986·Granted May 31, 1988·22 cites·5 claims
- 3054US7231277B2Surface shape determining device for a machining apparatus and surface shape determining methodNIPPEI TOYAMA CORP·Filed 2005·Granted Jun 12, 2007·1 cites·8 claims
- 3154US5914880AMethod and apparatus for controlling a transfer machineNIPPEI TOYAMA CORP·Filed 1997·Granted Jun 22, 1999·27 cites·28 claims
- 3253US6626735B2Method of stopping machining operation in machine tool and machining controlling apparatus for implementing the sameNIPPEI TOYAMA CORP·Filed 2001·Granted Sep 30, 2003·8 cites·12 claims
- 3352US5885200ATool change deviceNIPPEI TOYAMA CORP·Filed 1997·Granted Mar 23, 1999·18 cites·15 claims
- 3451US6026549ACrankpin phase indexing method and apparatusNIPPEI TOYAMA CORP·Filed 1996·Granted Feb 22, 2000·16 cites·21 claims
- 3551USD399855SWire guiding rollerNIPPEI TOYAMA CORP·Filed 1997·Granted Oct 20, 1998·7 cites·1 claims
- 3647US6112737AWire saw and method of cutting workNIPPEI TOYAMA CORP·Filed 1998·Granted Sep 5, 2000·12 cites·10 claims
- 3746US6077146AMethod of correcting a taper in a grinding machine, and apparatus for the sameNIPPEI TOYAMA CORP·Filed 1998·Granted Jun 20, 2000·14 cites·20 claims
- 3846US5042203AAbrasive disc exchange apparatus for use in vertical-spindle grinding machineNIPPEI TOYAMA CORP·Filed 1989·Granted Aug 27, 1991·9 cites·7 claims
- 3945US6179909B1Work crystal orientation adjusting method and apparatusNIPPEI TOYAMA CORP·Filed 1998·Granted Jan 30, 2001·13 cites·18 claims
- 4045US6024814AMethod for processing ingotsNIPPEI TOYAMA CORP·Filed 1996·Granted Feb 15, 2000·10 cites·21 claims
- 4144US6296553B1Grinding method, surface grinder, workpiece support, mechanism and work restNIPPEI TOYAMA CORP·Filed 1998·Granted Oct 2, 2001·11 cites·39 claims
- 4242US6220931B1Feeding a grinding wheel in grinding methodNIPPEI TOYAMA CORP·Filed 1999·Granted Apr 24, 2001·8 cites·6 claims
- 4339US6036585AGrinder and grinding methodNIPPEI TOYAMA CORP·Filed 1998·Granted Mar 14, 2000·7 cites·26 claims
- 4438US6113489AIngot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatusNIPPEI TOYAMA CORP·Filed 1999·Granted Sep 5, 2000·8 cites·3 claims
- 4537US7461439B2Method for detecting malfunction in clamping and machine toolNIPPEI TOYAMA CORP·Filed 2007·Granted Dec 9, 2008·0 cites·4 claims
- 4636US7568969B2Locking mechanism of linear motor travel slider and processing machineNIPPEI TOYAMA CORP·Filed 2004·Granted Aug 4, 2009·0 cites·12 claims
- 4736USD421994SWire saw housingNIPPEI TOYAMA CORP·Filed 1998·Granted Mar 28, 2000·1 cites·1 claims
- 4833USD401249SRoller for a wire saw for semiconductorsNIPPEI TOYAMA CORP·Filed 1997·Granted Nov 17, 1998·3 cites·1 claims
- 4931USD410014SWire saw housingNIPPEI TOYAMA CORP·Filed 1998·Granted May 18, 1999·0 cites·1 claims
- 5031USD409209SWire saw housingNIPPEI TOYAMA CORP·Filed 1998·Granted May 4, 1999·0 cites·1 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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