Assignee
NISHIHATA NAOMITSU
JP·4 granted patents·35 citations·filing 2005–2012
Top patents by PatentIndex Score
4 records- 0189US8642682B2Resin composition for encapsulation and semiconductor unit encapsulated with resinNISHIHATA NAOMITSU·Filed 2005·Granted Feb 4, 2014·21 cites·6 claims
- 0285US8158242B2Stock shape for machining and production process thereofNISHIHATA NAOMITSU·Filed 2011·Granted Apr 17, 2012·9 cites·9 claims
- 0377US8860233B2Resin composition for encapsulation and semiconductor unit encapsulated with resinNISHIHATA NAOMITSU·Filed 2012·Granted Oct 14, 2014·4 cites·13 claims
- 0455US8158240B2Stock shape for machiningNISHIHATA NAOMITSU·Filed 2005·Granted Apr 17, 2012·1 cites·7 claims
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