Assignee
NODA NAOKI
JP·2 granted patents·2 pending applications·3 citations·filing 2009–2010
Top patents by PatentIndex Score
4 records- 0161US8592285B2Method of bonding semiconductor substrate and MEMS deviceNODA NAOKI·Filed 2009·Granted Nov 26, 2013·2 cites·19 claims
- 0254US8896132B2Electronic device and fabrication method thereofNODA NAOKI·Filed 2010·Granted Nov 25, 2014·1 cites·7 claims
- 0339US2012299128A1Method of bonding semiconductor substrate and mems deviceNODA NAOKI·Filed 2009·Application pending·0 cites
- 0439US2012319220A1Method of bonding semiconductor substrate and mems deviceNODA NAOKI·Filed 2009·Application pending·0 cites
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