Assignee
NORITAKE CHIKAGE
JP·1 granted patent·2 pending applications·7 citations·filing 2011–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0178US8530281B2Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chipNORITAKE CHIKAGE·Filed 2011·Granted Sep 10, 2013·7 cites·10 claims
- 0241US2011316143A1Semiconductor module with cooling mechanism and production method thereofNORITAKE CHIKAGE·Filed 2011·Application pending·0 cites
- 0334US2011316142A1Semiconductor module with resin-molded package of heat spreader and power semiconductor chipNORITAKE CHIKAGE·Filed 2011·Application pending·0 cites
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