Assignee
NORTH CORP
JP·5 granted patents·1 pending application·398 citations·filing 1999–2005
Top patents by PatentIndex Score
6 records- 0198US6528874B1Wiring circuit substrate and manufacturing method thereofNORTH CORP·Filed 2000·Granted Mar 4, 2003·120 cites·24 claims
- 0295US6646337B2Wiring circuit substrate and manufacturing method thereforNORTH CORP·Filed 2002·Granted Nov 11, 2003·50 cites·25 claims
- 0391US6828221B2Manufacturing method for wiring circuit substratesNORTH CORP·Filed 2002·Granted Dec 7, 2004·37 cites·4 claims
- 0489US6782610B1Method for fabricating a wiring substrate by electroplating a wiring film on a metal baseNORTH CORP·Filed 1999·Granted Aug 31, 2004·141 cites·4 claims
- 0588US6884709B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateNORTH CORP·Filed 2003·Granted Apr 26, 2005·50 cites·4 claims
- 0641US2005224256A1Interlayer member used for producing multilayer wiring board and method of producing the sameNORTH CORP·Filed 2005·Application pending·0 cites
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