Assignee
OAK MITSUI INC
US·12 granted patents·1 pending application·310 citations·filing 1995–2009
Top patents by PatentIndex Score
13 records- 0193US6657849B1Formation of an embedded capacitor plane using a thin dielectricOAK MITSUI INC·Filed 2000·Granted Dec 2, 2003·93 cites·29 claims
- 0290US7596842B2Method of making multilayered construction for use in resistors and capacitorsOAK MITSUI INC·Filed 2005·Granted Oct 6, 2009·19 cites·19 claims
- 0381US7862900B2Multilayered construction for use in resistors and capacitorsOAK MITSUI INC·Filed 2009·Granted Jan 4, 2011·7 cites·22 claims
- 0481US6610417B2Nickel coated copper as electrodes for embedded passive devicesOAK MITSUI INC·Filed 2001·Granted Aug 26, 2003·36 cites·24 claims
- 0580US6606792B1Process to manufacturing tight tolerance embedded elements for printed circuit boardsOAK MITSUI INC·Filed 2000·Granted Aug 19, 2003·29 cites·31 claims
- 0679US5679230ACopper foil for printed circuit boardsOAK MITSUI INC·Filed 1995·Granted Oct 21, 1997·69 cites·18 claims
- 0773US6495244B1Manufacturing fire retardant circuit boards without the use of fire retardant resin additivesOAK MITSUI INC·Filed 2000·Granted Dec 17, 2002·21 cites·33 claims
- 0866US6500349B2Manufacture of printed circuits using single layer processing techniquesOAK MITSUI INC·Filed 2000·Granted Dec 31, 2002·15 cites·23 claims
- 0965US7413815B2Thin laminate as embedded capacitance material in printed circuit boardsOAK MITSUI INC·Filed 2004·Granted Aug 19, 2008·12 cites·8 claims
- 1064US7672113B2Polymer-ceramic composites with excellent TCCOAK MITSUI INC·Filed 2007·Granted Mar 2, 2010·3 cites·27 claims
- 1146US6629348B2Substrate adhesion enhancement to filmOAK MITSUI INC·Filed 2001·Granted Oct 7, 2003·3 cites·32 claims
- 1239US6763575B2Printed circuit boards having integrated inductor coresOAK MITSUI INC·Filed 2001·Granted Jul 20, 2004·3 cites·39 claims
- 1332US2004075528A1Printed circuit heaters with ultrathin low resistivity materialsOAK MITSUI INC·Filed 2002·Application pending·0 cites
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