Assignee
OCG MICROELECTRONIC MATERIALS
US·71 granted patents·1,057 citations·filing 1989–1996
Top patents by PatentIndex Score
71 records- 0190US5541033ASelected o-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Jul 30, 1996·37 cites·48 claims
- 0290US5378802AMethod for removing impurities from resist components and novolak resinsOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Jan 3, 1995·46 cites·11 claims
- 0389US5648324APhotoresist stripping compositionOCG MICROELECTRONIC MATERIALS·Filed 1996·Granted Jul 15, 1997·66 cites·4 claims
- 0486US5446125AMethod for removing metal impurities from resist componentsOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Aug 29, 1995·52 cites·21 claims
- 0586US5240811APhotogenerated polycarbodiimides from poly(tetrazole-5-thiones) and use in the preparation of coatings and deep-UV photoresistsOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Aug 31, 1993·30 cites·7 claims
- 0685US5597678ANon-corrosive photoresist stripper compositionOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Jan 28, 1997·65 cites·4 claims
- 0785US5300628ASelected chelate resins and their use to remove multivalent metal impurities from resist componentsOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Apr 5, 1994·47 cites·11 claims
- 0884US5547814AO-quinonediazide sulfonic acid esters of phenolic compounds and their use in forming positive imagesOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Aug 20, 1996·22 cites·16 claims
- 0983US5561105AChelating reagent containing photoresist stripper compositionOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Oct 1, 1996·46 cites·10 claims
- 1082US5602260ASelected O-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Feb 11, 1997·19 cites·3 claims
- 1178US5472830ANon-corrosion photoresist stripping compositionOCG MICROELECTRONIC MATERIALS·Filed 1994·Granted Dec 5, 1995·32 cites·7 claims
- 1276US5550004AChemically amplified radiation-sensitive compositionOCG MICROELECTRONIC MATERIALS·Filed 1994·Granted Aug 27, 1996·25 cites·8 claims
- 1375US5558978APhotoresist compositions containing copolymers having acid-labile groups and recurring units derived from either N-(hydroxymethyl)maleimide or N-(acetoxymethyl)maleimide or bothOCG MICROELECTRONIC MATERIALS·Filed 1994·Granted Sep 24, 1996·44 cites·11 claims
- 1474US5507978ANovolak containing photoresist stripper compositionOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Apr 16, 1996·35 cites·9 claims
- 1574US5346799ANovolak resins and their use in radiation-sensitive compositions wherein the novolak resins are made by condensing 2,6-dimethylphenol, 2,3-dimethylphenol, a para-substituted phenol and an aldehydeOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Sep 13, 1994·22 cites·8 claims
- 1673US5164286APhotoresist developer containing fluorinated amphoteric surfactantOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Nov 17, 1992·28 cites·12 claims
- 1771US5276126ASelected novolak resin planarization layer for lithographic applicationsOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Jan 4, 1994·32 cites·17 claims
- 1871US5145763APositive photoresist compositionOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Sep 8, 1992·25 cites·37 claims
- 1970US5215856ATris-(hydroxyphenyl) lower alkane compounds as sensitivity enhancers for o-quinonediazide containing radiation-sensitive compositions and elementsOCG MICROELECTRONIC MATERIALS·Filed 1989·Granted Jun 1, 1993·21 cites·11 claims
- 2069US5340687AChemically modified hydroxy styrene polymer resins and their use in photoactive resist compositions wherein the modifying agent is monomethylol phenolOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Aug 23, 1994·16 cites·7 claims
- 2169US5196289ASelected block phenolic oligomers and their use in radiation-sensitive resist compositionsOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Mar 23, 1993·15 cites·13 claims
- 2267US5413894AHigh ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted May 9, 1995·12 cites·15 claims
- 2366US5151219AUse of particular mixtures of ethyl lactate and methyl ethyl ketone to remove undesirable peripheral material (e.g. edge beads) from photoresist-coated substratesOCG MICROELECTRONIC MATERIALS·Filed 1989·Granted Sep 29, 1992·20 cites·3 claims
- 2465US5545353ANon-corrosive photoresist stripper compositionOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Aug 13, 1996·24 cites·7 claims
- 2565US5283374ASelected phenolic derivatives of 4-(4-hydroxyphenyl)-cyclohexanone and their use as sensitivity enhancers for radiation sensitive mixturesOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Feb 1, 1994·19 cites·9 claims
- 2664US5494785AHigh ortho-ortho bonded novolak binder resins and their use in a process for forming positive resist patternsOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Feb 27, 1996·15 cites·12 claims
- 2762US5565304AChemically amplified radiation-sensitive composition used in a process for fabricating a semiconductor deviceOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Oct 15, 1996·24 cites·12 claims
- 2858US5473045AHigh ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositionsOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Dec 5, 1995·14 cites·20 claims
- 2958US5177172ASelected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositionsOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Jan 5, 1993·14 cites·3 claims
- 3058US5069996AProcess for developing selected positive photoresistsOCG MICROELECTRONIC MATERIALS·Filed 1989·Granted Dec 3, 1991·15 cites·9 claims
- 3156US5346808APositive image formation utilizing o-quinonediazide composition including selected phenolic derivatives of 4-(4-hydroxyphenyl)-cyclohexanoneOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Sep 13, 1994·4 cites·7 claims
- 3254US5554797ATetra (hydroxphenyl) alkanesOCG MICROELECTRONIC MATERIALS·Filed 1995·Granted Sep 10, 1996·4 cites·1 claims
- 3352US5446126AMethod for removing metal impurities from resist componentsOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Aug 29, 1995·8 cites·10 claims
- 3450US5232819ASelected block phenolic oligomers and their use in phenolic resin compositions and in radiation-sensitive resist compositionsOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Aug 3, 1993·4 cites·3 claims
- 3549US5776657AWet-chemical developable, etch-stable photoresist for UV radiation with a wavelength below 200 NMOCG MICROELECTRONIC MATERIALS·Filed 1996·Granted Jul 7, 1998·10 cites·8 claims
- 3648US5278021AO-naphthoquinone diazide sulfonyl esters of 4-(4-hydroxyphenyl)cyclohexanone phenolic derivatives with associated radiation sensitive mixtures and articlesOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Jan 11, 1994·7 cites·10 claims
- 3747US5063138APositive-working photoresist process employing a selected mixture of ethyl lactate and ethyl 3-ethoxy propionate as casting solvent during photoresist coatingOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Nov 5, 1991·10 cites·10 claims
- 3846US5284737AProcess of developing an image utilizing positive-working radiation sensitive mixtures containing alkali-soluble binder, o-quinonediazide photoactive compound and blankophor FBW actinic dyeOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Feb 8, 1994·8 cites·5 claims
- 3946US5237037ARadiation-sensitive compositions containing fully substituted novolak polymersOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Aug 17, 1993·11 cites·11 claims
- 4046US5151339APhotoresist composition containing diazoquinone photosensitizer and novalak resin characterized by the complete and selective removal of dimeric species from the novolak resinOCG MICROELECTRONIC MATERIALS·Filed 1991·Granted Sep 29, 1992·6 cites·5 claims
- 4144US5366843ACoated substrate utilizing composition including selected phenolic derivatives of 4-(4-hydroxyphenyl)-cyclohexanone as sensitivity enhancersOCG MICROELECTRONIC MATERIALS·Filed 1994·Granted Nov 22, 1994·7 cites·9 claims
- 4243US5275911ASesamol/aldehyde condensation products as sensitivity enhancers for radiation sensitive mixturesOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Jan 4, 1994·5 cites·10 claims
- 4343US5132376AProcess for selective removal of dimeric species from phenolic polymersOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Jul 21, 1992·5 cites·9 claims
- 4442US5302688ASelected block phenolic oligomers and their use in phenolic resin compositions and in radiation-sensitive resist compositionsOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Apr 12, 1994·5 cites·4 claims
- 4542US5234789APolylactide compounds as sensitivity enhancers for radiation sensitive mixtures containing o-quinonediazide photoactive compoundsOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Aug 10, 1993·9 cites·9 claims
- 4641US5234795AProcess of developing an image-wise exposed resist-coated substrateOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Aug 10, 1993·6 cites·3 claims
- 4741US5151340ASelected photoactive methylolated cyclohexanol compounds and their use in radiation-sensitive mixturesOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Sep 29, 1992·6 cites·13 claims
- 4839US5235022ASelected block copolymer novolak binder resinsOCG MICROELECTRONIC MATERIALS·Filed 1992·Granted Aug 10, 1993·5 cites·6 claims
- 4939US5024921AThermally stable light-sensitive compositions with o-quinone diazide and phenolic resin used in a method of forming a positive photoresist imageOCG MICROELECTRONIC MATERIALS·Filed 1990·Granted Jun 18, 1991·5 cites·3 claims
- 5037US5328806APositive image formation utilizing radiation sensitive mixture containing dimeric or trimeric sesamol/aldehyde condensation products as sensitivity enhancersOCG MICROELECTRONIC MATERIALS·Filed 1993·Granted Jul 12, 1994·3 cites·6 claims
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