Assignee
OERLIKON ASSEMBLY EQUIPMENT AG
CH·1 granted patent·8 pending applications·16 citations·filing 2006–2009
Top patents by PatentIndex Score
9 records- 0179US7597234B2Method for mounting a flip chip on a substrateOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2006·Granted Oct 6, 2009·16 cites·2 claims
- 0242US2008302857A1Wire clamp for a wire bonderOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2008·Application pending·0 cites
- 0341US2008308609A1Bond head for a wire bonderOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2008·Application pending·0 cites
- 0440US2010224715A1Wire supply device for a wire bonderOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2007·Application pending·0 cites
- 0539US2009144968A1Pick-Up Tool And Method For Grasping And Mounting Small DiesOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2008·Application pending·0 cites
- 0639US2009271978A1Foil Perforating Needle For Detaching A Small Die From The FoilOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2008·Application pending·0 cites
- 0739US2009218385A1Wire bonderOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2009·Application pending·0 cites
- 0832US2008314264A1Device For Pressing On Semiconductor Chips Arranged On A SubstrateOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2008·Application pending·0 cites
- 0931US2009070992A1Pick And Place System For A Semiconductor Mounting ApparatusOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2008·Application pending·0 cites
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