Assignee
OGASHIWA TOSHINORI
JP·6 granted patents·8 citations·filing 2008–2013
Top patents by PatentIndex Score
6 records- 0178US8505804B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2008·Granted Aug 13, 2013·8 cites·3 claims
- 0249US8962471B2Bump, method for forming the bump, and method for mounting substrate having the bump thereonOGASHIWA TOSHINORI·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 0349US8558433B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2012·Granted Oct 15, 2013·0 cites·4 claims
- 0444US8492894B2Bump, method for forming the bump, and method for mounting substrate having the bump thereonOGASHIWA TOSHINORI·Filed 2010·Granted Jul 23, 2013·0 cites·3 claims
- 0539US9065418B2Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same materialOGASHIWA TOSHINORI·Filed 2010·Granted Jun 23, 2015·0 cites·18 claims
- 0636US8912088B2Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrateOGASHIWA TOSHINORI·Filed 2011·Granted Dec 16, 2014·0 cites·12 claims
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