Assignee
OGAWA HIDEKI
JP·10 granted patents·2 pending applications·30 citations·filing 2006–2012
Top patents by PatentIndex Score
12 records- 0192US8749339B2Coil-type electronic component and process for producing sameOGAWA HIDEKI·Filed 2011·Granted Jun 10, 2014·8 cites·17 claims
- 0284US8813346B2Method for manufacturing a coil-type electronic componentOGAWA HIDEKI·Filed 2011·Granted Aug 26, 2014·3 cites·11 claims
- 0381US8643455B2Coil componentOGAWA HIDEKI·Filed 2011·Granted Feb 4, 2014·5 cites·18 claims
- 0480US8704629B2Coil-type electronic component and its manufacturing methodOGAWA HIDEKI·Filed 2012·Granted Apr 22, 2014·3 cites·12 claims
- 0579US8390415B2Coil componentOGAWA HIDEKI·Filed 2012·Granted Mar 5, 2013·4 cites·7 claims
- 0677US8723634B2Coil-type electronic component and its manufacturing methodOGAWA HIDEKI·Filed 2011·Granted May 13, 2014·3 cites·14 claims
- 0767US8587568B2Integrated circuit device, electronic apparatus and method for manufacturing of electronic apparatusOGAWA HIDEKI·Filed 2010·Granted Nov 19, 2013·1 cites·14 claims
- 0863US8866829B2Integrated circuit device and electronic equipmentOGAWA HIDEKI·Filed 2010·Granted Oct 21, 2014·2 cites·16 claims
- 0962US9143447B2Closed loop formation preventing system and closed loop formation preventing methodOGAWA HIDEKI·Filed 2011·Granted Sep 22, 2015·1 cites·9 claims
- 1056US2014191835A1Magnetic material and coil component employing sameOGAWA HIDEKI·Filed 2012·Application pending·0 cites
- 1146US8766464B2Integrated circuit device and electronic apparatusOGAWA HIDEKI·Filed 2010·Granted Jul 1, 2014·0 cites·15 claims
- 1239US2006267215A1Semiconductor device, semiconductor device mounting board, and method for mounting semiconductor deviceOGAWA HIDEKI·Filed 2006·Application pending·0 cites
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