Assignee
OGURA ICHIRO
JP·2 granted patents·3 citations·filing 2008–2011
Top patents by PatentIndex Score
2 records- 0165US8263714B2Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resinOGURA ICHIRO·Filed 2011·Granted Sep 11, 2012·2 cites·6 claims
- 0255US8401390B2Optical connecting apparatusOGURA ICHIRO·Filed 2008·Granted Mar 19, 2013·1 cites·8 claims
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