Assignee
OGURA ICHIROU
JP·4 granted patents·1 pending application·3 citations·filing 2006–2011
Top patents by PatentIndex Score
5 records- 0165US8084567B2Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resinOGURA ICHIROU·Filed 2009·Granted Dec 27, 2011·3 cites·3 claims
- 0251US8440781B2Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resinOGURA ICHIROU·Filed 2009·Granted May 14, 2013·0 cites·8 claims
- 0345US8420749B2Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resinOGURA ICHIROU·Filed 2006·Granted Apr 16, 2013·0 cites·9 claims
- 0441US8703845B2Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing materialOGURA ICHIROU·Filed 2011·Granted Apr 22, 2014·0 cites·16 claims
- 0532US2013184377A1Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating materialOGURA ICHIROU·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →